RELIFE Solder Paste Tin Cream For PCB BGA SMD 40gm (138C) RL-404

RELIFE 40g 138℃ Lead-Free Low Temperature Welding Solder Paste For Mobile Phone PCB BGA/SMD Motherboard Welding Fluxes

Product details：

①：RL-404 138℃ low temperature tin paste

②：The temperature is accurate, the tin is lit, and the circuit board components are effectively protected

③：No false welding, less residue, bright solder joints, strong tin climbing, good conductivity, oxidation resistance, no corrosion to PCB, no cleaning
④：Suitable for sensors, wires, motors, fuses, connectors, metal shells, lighting, electronic components,  patches, BGA soldering, chip planting tin, LED patches, etc.

RL-406 227°c  High Temperature Lead-free Solder Paste

①：Suitable for high-end machine motherboards/electronic components/BGA
chips/ maintenance, etc.

②：Good wettability, strong viscosity

③：Preferred raw materials, lead-free and environmentally friendly

④：227°c Accurate temperature, effective protection of circuit board components