RELIFE Solder Paste Tin Cream For PCB BGA SMD 40gm (138C) RL-404

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RELIFE 40g 138℃ Lead-Free Low Temperature Welding Solder Paste For Mobile Phone PCB BGA/SMD Motherboard Welding Fluxes

Product details:

①:RL-404 138℃ low temperature tin paste

②:The temperature is accurate, the tin is lit, and the circuit board components are effectively protected

③:No false welding, less residue, bright solder joints, strong tin climbing, good conductivity, oxidation resistance, no corrosion to PCB, no cleaning
④:Suitable for sensors, wires, motors, fuses, connectors, metal shells, lighting, electronic components,  patches, BGA soldering, chip planting tin, LED patches, etc.

RL-406 227°c  High Temperature Lead-free Solder Paste

①:Suitable for high-end machine motherboards/electronic components/BGA
chips/ maintenance, etc.

②:Good wettability, strong viscosity

③:Preferred raw materials, lead-free and environmentally friendly

④:227°c Accurate temperature, effective protection of circuit board components


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