M&R Solder Paste Soldering Tin Cream For PCB BGA SMD 42gm (XGSP50)
SKU: 2238675
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EGP 220.00
EGP 250.00
-12%
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Description
Features:
Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on Good soldering and welding tool
Specification:
Material: Plastic+solder paste
Type: XGSP50
Alloy: Sn63/Pb37
Microns: 3#
Weight : 42gm
Application:
Mobile phone repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc.
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